Interface Material

  • High thermal conductivity
  • Can fill the vacancy perfectly
  • Customization(size)

Product description

PI thermal pad is consisted of silica gel,PI film,specific thermal dust and goes through the vulcanization process.Since it's soft and self-adhesive(one side), it has better tensile strength and voltage resistance,and therefore becomes the ideal material for fill-in thermal conduction.

Product feature

High voltage resistance,self-adhesive(one side),puncture proof,vibration proof,antifriction,easy processing and so on.


LED illumination,industrial communication device,power battery pack,cooling device and so on.

Physical property tables

PI Thermal Pad
Sub product photo Model Specification
APD100PI Customization Inquiry
APD150PI Customization Inquiry
APD200PI Customization Inquiry
APD250PI Customization Inquiry
APD300PI Customization Inquiry
APD400PI Customization Inquiry
APD500PI Customization Inquiry
APD600PI Customization Inquiry

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