PI thermal pad is consisted of silica gel,PI film,specific thermal dust and goes through the vulcanization process.Since it's soft and self-adhesive(one side), it has better tensile strength and voltage resistance,and therefore becomes the ideal material for fill-in thermal conduction.

High voltage resistance,self-adhesive(one side),puncture proof,vibration proof,antifriction,easy processing and so on.

LED illumination,industrial communication device,power battery pack,cooling device and so on.