PI thermal pad is consisted of glass fiber,silca gel,specific thermal dust and goes through the vulcanization process at high temperature. Since it's soft and self-adhesive(one side),it has better tensile strength and voltage resistance,and therefore becomes the ideal material for fill-in thermal conduction.

Very soft,high voltage resistance,self-adhesive(one side),glass fiber improves the strength,can be punched without deformation,puncture proof, vibration proof,antifriction and so on.

LED illumination,industrial communication device,power battery pack and so on.