Interface Material

  • High Thermal conductivity
  • Suitable for products with high heat flux

Product description

This thermal organic paste-complex compound takes organic silicon as main material and adding other materials with outstanding heat resistance and thermal performance. It can stay in paste stage for long time under the temperature from -40℃ to 200℃.

Product feature

Can stay in paste stage for long time to achieve the best filling-in effect.However,it's not self-adhesive.


Laptop,personal computer,TV,dash cam,power board of appliances and so on.

Physical property tables

Thermal Grease
Sub product photo Model Specification
APD10G Customization Inquiry
APD15G Customization Inquiry
APD20G Customization Inquiry
APD25G Customization Inquiry
APD30G Customization Inquiry
APD40G Customization Inquiry
APD50G Customization Inquiry

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